Low Profile Mast and Rotational Module Component Prototype Other Transaction Area of Interest
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Description
*10.6.2026: Added Attachment 10: (CUI) LPM-RM AOI Q&A Release. This attachment was also sent to interested parties with a validated TOU on file via DoD SAFE. Those without a TOU on file will need to follow the TOU process outlined in the AOI and request access to restricted Attachment 10 in SAM. *9.23.2026: Updated Attachment 1: TOU to correct the listed PCO within the document. Team Submarines, Australia, United Kingdom, and United States (AUKUS), International & Systems (AI&S), Submarine Electromagnetic Systems Program Office (PMS 435) is pleased to release a competitive Area of Interest (AOI) announcement for the Low Profile Mast (LPM) and Rotational Module (RM) component to address several key operational needs. The LPM/RM programs seek innovative technologies that accelerate the prototyping of capabilities that address these key operational needs. To accelerate the design, development and demonstration of LPM/RM capabilities, the Navy will be utilizing the Other Transaction Authority pathway outlined in Title 10 U.S.C. � 4022. It is intended that this solicitation may result in the award of one or more prototype projects. There are nine (9) attachments to this AOI, some of which contain Controlled Unclassified Information (CUI): LPM/RM Terms of Use Agreement AOI AOI Guidance CUI LPM Type 24 Mod 1Top-Level Requirements Document [RESTRICTED] CUI LPM Verification Guide (VG) [RESTRICTED] CUI RM Top-Level Requirements Document [RESTRICTED] CUI RM Verification Guide [RESTRICTED] LPM/RM AOI Questions Form CUI LPM/RM Placemat Template [RESTRICTED] Companies are advised to proceed with the following steps to respond to this notice: STEP 1 � Terms of Use Agreement (TOU) Several key documents related to the LPM Type 24 Mod 1 and RM are only releasable to eligible businesses with ownership in the United States, the United Kingdom, and Australia. Non-Australia, United Kingdom, or United States foreign-owned businesses may submit a technical solution as part of a teaming arr…